Detailed explanation of PCB electroplating process
Author:Yang Ping Time:2021-06-11 08:01 Browse(518)
PCB electroplating process, touch screen and OLED Forum
The electroplating process of circuit board can be roughly classified into acid bright copper electroplating, nickel / gold electroplating and tin electroplating.
the processing process of circuit board is the technology and process flow of electroplating process, as well as the specific operation method.
the process of circuit board is divided into three categories( V% `; [ 1 A$ P- ?* b5 R- a+ B.

Detailed explanation of PCB electroplating process

W9 w- W; ~* ^ 4 AI. process flow- x" R/ V, X9 O' a; X4 i( }+ h+ |5 Z$ Z, @2 m pickling → copper plating on the whole plate → pattern transfer → acid degreasing → two-stage countercurrent rinsing → micro etching → two-stage countercurrent rinsing → pickling → tin plating → two-stage countercurrent rinsing → countercurrent rinsing → pickling → pattern copper plating → two-stage countercurrent rinsing → nickel plating → two-stage water washing → citric acid leaching → gold plating → recovery → 2-3-stage → pure water washing → drying; C# W# |.
H, L1 E2 ^ $d "~ 7 [, Q 2. Process description$ j( L9 i3 p- r& p# D7 I! D) n8 h# T8 \! _+ j' j5 F$ S0 _(I) acid leaching8 ?# \( k1 e) L9 M$ R) P( a3 q5 ~. A. i# T/ A9 t(1) function and purpose: 3 b) M 6 w 4 S: V & Z 2 O. P, I (e 5)~" Q: q0 p- c    J* YTo remove the oxide on the surface and activate the surface, the concentration is generally 5%, and some are kept at about 10%, mainly to prevent water from bringing in and causing unstable sulfuric acid content in the tank liquid;   ] 0 U& l: I: q2 b: e# Y2 e7 ]    h: m    i5 ?The acid leaching time should not be too long,Prevent the board surface from oxidation; After using for a period of time, if the acid solution is turbid or the copper content is too high, it should be replaced in time to prevent polluting the surface of copper plating cylinder and plate;% w! c2 Z& Z- f5 {7 X8 z: b. a* k0 [; |! S1 V7 E & R ③ grade C.P sulfuric acid should be used here.
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~ 9 ~, W! ^8 W9 H   } 4 N3 o' `) N   |" Q; G    U! R& u(2) whole plate copper plating: also called primary copper, plate plating.
$P4 |) L8 ~ & C; A1 T( O. a$ I5 L: K    d. N(1) function and purpose: 4 a0l9 z%] $n * t + n1 B - Z - ''n "x protects the thin chemical copper just deposited.
prevents the chemical copper from being eroded by acid after oxidation, and adds it to a certain extent by electroplating;4 {6 S- I' m( p) \' |+ _ 7 J$ z+ [" \) s& f& U(2) related process parameters of copper plating on the whole plate: the main components of bath solution are copper sulfate and sulfuric acid, and the formula of high acid and low copper is adopted to ensure the uniformity of plate thickness distribution and the deep plating ability of deep holes and small holes; The content of sulfuric acid is 180 g / L and 240 g / L respectively; The content of CuSO4 is about 75 g / L. in addition, a small amount of chloride ion is added to the bath solution to give full play to the gloss effect as auxiliary gloss agent and copper gloss agent; The dosage of copper polish is generally 3-5ml / L, and the dosage of copper polish is usually supplemented by the method of kiloampere hour or according to the actual production effect; The current of whole board electroplating is generally calculated as 2 A / square decimeter multiplied by the electroplating area on the board,For full board power, the board length is DM × Board width DM × two × 2A/ DM2; The temperature of the copper cylinder is maintained at room temperature. Generally, the temperature is not more than 32 degrees, and most of them are controlled at 22 degrees; For more information, please visit the official website: www.jiepei.com/G1560 u7 R1 B6 v) H7 L& Q4 M) Z) m8 U5 p. b# A2 |.
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