What is the main content of AOI automatic detector after the solder paste printing machine?
Author:average Time:2021-06-11 13:36 Browse(525)
What is the main content of AOI automatic detector after the solder paste printing machine, Touch screen and OLED Forum
With the development of the current electronic industry market, AOI automatic optical detector is the best choice to improve efficiency and save time.
Advanced AOI automatic detection equipment can completely replace manual work.

What is the main content of AOI automatic detector after the solder paste printing machine?

with high detection accuracy, the specified detection steps can be completed in a few seconds to get the results, The production efficiency is improved.
what is the main content of AOI automatic detector after the solder paste printing machine?0 M& M* A3 V. }9 G+ F8 A) h% m) n* h: o$ `8 ~9 \& O& @. h! H' ]7 j' [' kIf the solder paste printing process meets the requirements.
the number of defects found by ICT can be greatly reduced.
typical printing defects include the following points:7 Y7 a    O6 a- K( F9 `: e& g$ n5 r8 }! \ 9 ?& N & B 1. Insufficient solder on pad9 I6 d- D    u' m5 u& U( a4 q* b    K 2. Too much solder on the pad.
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b* I4 I    b: U; P6 U, |# W. ]3 _3. Poor overlap of solder to pad.
9 \ $g * d% Z / ^ 9 O3 Q / A1 n; ` 5 Q # - 3 N0 {: e 4. Solder bridge between pads.
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C    X9 |! C4 y6 N2 Z2 l/ w& W2 m! q. J# M$ m+ X& m. G, iIn ICT,The probability of defects in these cases is directly proportional to the severity of the situation.
slight lack of tin rarely leads to defects.
in severe cases, such as fundamental Wuxi, defects are almost always caused by ICT.
insufficient solder may be one of the reasons for component loss or open solder joint.
nevertheless,
to decide where to place AOI, we need to recognize that component loss may be caused by other reasons, These reasons must be included in the inspection plan.
the inspection at this position most directly supports process tracking and characterization.
the quantitative process control data at this stage includes information about printing offset and solder quantity, and qualitative information about printing solder will also be generated.
the quantitative process control data at this stage includes information about printing offset and solder quantity2 K2 A8 m1 ^5 @! o- q. ]% @& P" W+ X/ x) [4 S7 y# e; R$ u) K/ B7 u6 N( X.
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