What are the characteristics of reflow soldering application technology?
Author:lily623f Time:2021-06-10 10:05 Browse(83)
What are the characteristics of reflow soldering application technology, Touch screen and OLED Forum
Reflow soldering is the most important technology in SMT. The quality of reflow soldering is the key to the reliability of SMA. It directly affects the performance reliability and economic benefits of electronic equipment. The welding quality depends on the welding method, welding material, welding technology and welding equipment. 9 y' I    V0 B4 {& `    Reflow soldering application is to put the circuit board installed with SMT components into SMT reflow soldering chamber, and melt the solder paste used for soldering SMT components through high temperature hot air to form reflow temperature change process, so that the SMT components are combined with the pads on the circuit board, and then cooled together. 3 a4 N+ I# B# _! U4 x6 I: \+ B) W3 a3 a( N6 Q9 ~: v3 lCharacteristics of reflow soldering technology&H7 K2 {3 G9 y% V2 A1. The thermal shock to the device is small, but sometimes it will give the device greater thermal stress. 1 \" ]9 |: y6 _' ]2. It can control the amount of solder paste and avoid the occurrence of defects such as bridging by applying solder paste only at the required position. 3 o! L& z. q6 A* Q3. The surface tension of the molten solder can correct the tiny deviation of the placement position of the component.Local heating heat source can be used to weld on the same substrate by different welding processes. 2 S; S% ^0 C5 @6 t5. Impurity will not be mixed in solder. When using solder paste, it can keep the composition of solder correctly.7 w9 l6 ^, Z- Q$ ^' W4 B# P6 z3 n。。。

What are the characteristics of reflow soldering application technology?

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