Function description of reflow soldering in SMT process
Author:Lu Jian Time:2021-06-10 09:33 Browse(744)
Description of reflow soldering in SMT process, touch screen and OLED Forum
The principle of reflow soldering is divided into several function descriptions) {. l: ]% i+ y$ c) B    N6 @4 \+ m1 c0 O   @/ v1. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate. At the same time, the flux in the solder paste moistens the pad, the end and the pin of the component. The solder paste softens, collapses and covers the pad, isolating the pad and the pin of the component from the oxygen& K# ? 7 N+ Z! Q/ T/ Y6 w8 A& W" H" A( w1 G7 y4 M. @/ Y3 j2. When the PCB enters the heat preservation zone, the PCB and components are fully preheated to prevent the PCB from suddenly entering the welding high temperature zone and damaging the PCB and components.3 n, w2 e8 `6 K- C1 C" `/ n1 H/ l2 R( D# A+ w7 d! b3 ~    Y3. When the PCB enters the welding area, the temperature rises rapidly to make the solder paste reach the melting state, and the liquid solder will wet, diffuse, diffuse or reflow the PCB pads, component ends and pins to form solder joints. 6 @; s6 o; ? 8 T3 e1 Q7 C2 b' J6 I: E0 f0 M4. The PCB enters the cooling zone to solidify the solder joint.3 T' |# q) R! @! u5 n' [0 L0 W+ Q0 e! b3 e# e    l    n( U6 l0 K/ _ 0 _。。

Function description of reflow soldering in SMT process

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