Second hand reflow recycling - factors affecting reflow process
Author:Zhang Jinghua Time:2021-06-10 17:57 Browse(819)
Second hand reflow recycling - factors affecting reflow process, touch screen and OLED Forum
2 J7 m, _) w! g4 h* J# v; Z + m + e-i2 c'x: e factors influencing reflow soldering process: & M (?)_ 6 a5 z    R$ ^8 M7 A6 y/ w3 p$ ?' v* M1. Generally, the specific heat capacity of PLCC and QFP is larger than that of single discrete sheet element, so it is more difficult to weld large area elements than small ones- x# p. i; M& N7 {; m$ k0 P* d. G. c2. In reflow soldering furnace, the conveyor belt is a heat dissipation system while reflow soldering the products. In addition, the temperature of the edge of the heating part is different from that of the center, and the temperature of the edge is generally low. In addition to the different temperature requirements of each temperature zone, the temperature of the same load surface is also different., k0 `+ w5 a- o4 S7 [. ~& N5 \ "S0 J9 G: T - Y: B $U5 R7 Z3. When adjusting the temperature curve of reflow soldering, good repeatability can be obtained under no-load, load and different load factors. The load factor is defined as: LF=L / (L + s); Where l=the length of the assembled substrate and S=the interval between the assembled substrates. The larger the load factor is, the more difficult it is for reflow process to get good repeatability. Generally, the large load factor of reflow soldering furnace ranges from 0.5 to 0.9. This depends on the product situation (component welding density, different substrates) and different models of reflow furnace. To get good welding effect and repeatability, practical experience is very important.$ p( N8 W, R: O! U+ W% V0 y3 N; d; ^) Y: T。。。。

Second hand reflow recycling - factors affecting reflow process

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