Zhichi technology shares important technical indexes of reflow soldering
Author:horsepower Time:2021-06-10 16:51 Browse(402)
Zhichi technology shares important technical indicators of reflow soldering, touch screen and OLED Forum
With the development of electronic industry technology, the components on the internal board of various electronic products are welded to the circuit board by reflow soldering. Reflow soldering is widely used in SMT production line. In order to achieve the soldering effect, it is necessary to understand the important technical indexes of reflow soldering. The technical indexes of reflow soldering are the key to the quality effect of reflow soldering products, Below, we'd like to share with you the important technical specifications of reflow soldering.

Zhichi technology shares important technical indexes of reflow soldering

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m; u! N1、 Temperature control accuracy: should reach ± 0.1-0.2℃.
* P3 n" `0 D: P/ H5 \2 S: R$ v" M: @7 p) V2、 Transverse temperature difference of conveyor belt: traditional requirements ± Below 5 ℃.
lead welding requirements<± 2℃.
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C! |* R$ x# u: B+ e0 J3、 Temperature curve test function: if the reflow welder does not have this configuration, the temperature curve collector should be purchased3 W0 w. ^( _- l' z" z: K3 @.
c, B1 S1 C4、 Heating temperature: generally 210-235 ℃. If lead-free solder or metal substrate is considered, it should be above 250 ℃.
7 F8 C8 L # K / D5 Q3 S2_9 B.] 9 P + L '} 6 M6 T: I 5. Number and length of heating zone: the longer the length of heating zone, the more the number of heating zone.
the easier it is to adjust and control the temperature curve.
25 }1 A& s: A1 R/ X" P* K4 M*U7 s - G3 S3 T "P 6. The width of conveyor belt should be determined according to the size of large and small PCB.
the width of conveyor belt should be determined according to the size of PCB: W$ z1 @" @: F/ X+ k) ^' U9 ?   ] 8 E- |/ v; Cooling efficiency: it should be determined according to the complexity and reliability of products.
products with complex and high reliability requirements should choose high cooling efficiency! j. I5 C( }* d.
n! x, D+ m( N% [* P      Reflow soldering is one of the three main processes in SMT mounting process.
reflow soldering uses imported heating parts.
the temperature is uniform, which is mainly used to weld the printed circuit board which has been mounted components. The solder paste is melted by heating to make the chip components and the printed circuit board pad welded together, and then the solder paste is cooled by the cooling of reflow soldering to solidify the components and pads together.
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