Application principle of reflow soldering
Author:samantha Time:2021-06-09 12:27 Browse(741)
Application principle of reflow soldering, touch screen and OLED Forum
% l( f# W; M+ u- w0 D1 k( E! G9 ?) R$ L9 B+ }0 r9 P Due to the need of miniaturization of electronic PCB board, sheet elements appear. The traditional welding method can not meet the needs. Reflow soldering is used in the assembly of hybrid integrated circuit board. Most of the components are chip capacitor, chip inductor, mount transistor and two transistor. With the development of SMT technology and the emergence of SMC and SMD, reflow soldering technology and equipment, as part of SMT technology, have been developed accordingly. It has been widely used in almost all electronic product fields. Reflow is a kind of reflow soldering that realizes the mechanical and electrical connection between the solder end or pin of surface mount components and the pad of printed circuit board by remelting the paste solder previously distributed to the pad of printed circuit board. Reflow soldering is to weld components to PCB board, and reflow soldering is for surface mount devices. Reflow soldering relies on the effect of hot air flow on the solder joint, and the colloidal flux reacts in a certain high temperature air flow to achieve SMD soldering; So it is called "reflow welding" because the gas circulates in the welding machine and produces high temperature to achieve the purpose of welding.( u: e6 u4 U+ p6 E) h9 M0 Y+ L% F! r) x0 R$ e7 E+ \: q5 Z5 V$ L& T。。。。。
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