Reflow time and temperature setting of reflow furnace
Author:Shi Rui Time:2021-06-07 15:45 Browse(991)
Reflow time and temperature setting of reflow oven, touch screen and OLED forum
The process parameters that affect the quality of reflow soldering are: preheating temperature of reflow soldering; The temperature of reflow holding zone; Reflow zone temperature of reflow soldering; The cooling zone temperature and transfer speed of reflow soldering mainly affect the efficiency of reflow welder.
0 Z5 E / J / h! Q" ]! {; b3 i1 [$ U5 a2 F# L       Reflow soldering is to weld the components to the PCB board.

Reflow time and temperature setting of reflow furnace

reflow soldering is to mount the components on the surface.
reflow soldering is to rely on the effect of hot air flow on the solder joint.
the colloidal flux carries out physical reaction under certain high temperature air flow to achieve SMD soldering; The reason why it is called "reflow welding" is that the gas circulates in the welding machine and produces high temperature to achieve the welding purpose.
$w9 a #] "Q: F4 W; u7 W* i9 K& V    R' ~- L2 i& a        Because of the formation rate of the common boundary metal compounds and the decomposition rate of the base metal in the solder.
its generation and filtration are not only proportional to the temperature, but also proportional to the time above the melting point temperature of the solder. In order to reduce the generation and filtration of the common boundary metal compounds, the time above the melting point temperature must be reduced, which is generally set between 45 and 90 seconds, This time limit requires the use of a rapid temperature rise rate, from the melting point temperature to the peak temperature, while considering the thermal stress factor$ M. j8 |& `1 _: X/ v* d- p( D6 f: W! ^ 6 b4 q        The speed of reflow soldering time determines the most important factor of reflow soldering quality.
if the reflow soldering time is too fast or too slow, a large number of bad reflow soldering products will be produced.
the so-called reflow soldering time is the soldering time when the products arrive at the soldering zone.
the reflow soldering time is the soldering time when the products arrive at the soldering zoneThe reflow time is usually called reflow time. The shorter the reflow time is, the better. Generally, it is 30-60 seconds. Different solder pastes have different requirements. Too long reflow time and higher temperature, such as reflow time greater than 90 seconds and the highest temperature greater than 230 degrees, will cause the thickening of the intermetallic compound layer and affect the long-term reliability of the solder joint.
the reflow time is usually called reflow time6 A    I1 f$ l' [: F% m: K   @& V5 g" t6 `        The maximum temperature of reflow zone of reflow oven is determined by the temperature resistance of temperature sensitive elements on PCB.
the maximum reflow temperature of reflow oven is more than 230 degrees.
it will cause the thickness of intermetallic compound layer and affect the long-term reliability of solder joint.
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