Process sequence of wave soldering and reflow soldering in SMT production line
Author:Zhao Fang Time:2021-06-07 17:54 Browse(460)
In SMT production line wave soldering and reflow soldering process sequence, touch screen and OLED forum
This post was edited by Shenzhen Zhichi at 16:03, September 6, 2019    b+ t5 h0 w( c! p. h% u- f! R+ p: K! c+ r8 j, P0 q- K; \% `7 f( `+ N0 v/ J/ W0 _        The process sequence of wave soldering and reflow soldering is known from the principle sequence of PCB assembly. The assembly principle is to assemble small components first and then large components.

Process sequence of wave soldering and reflow soldering in SMT production line

chip components are much smaller than plug-in components.
PCB assembly is in the order of small to large, So it must be reflow soldering before wave soldering.
Zhichi technology chip mounter manufacturers come to share the process flow of reflow soldering and wave soldering with Daxian.
% P-H    Y/ h1 U$ n5 zThe reflow soldering process is surface mount PCB.
the process is complex, which can be divided into two types: single side mount and double side mount$ o9 s: p.
l    w; W3 Y1 w% s8 m   ] 4 a. V' x1 b! oA. Single side mounting: paste printing machine → SMT machine (manual mounting and automatic mounting) → reflow soldering → AOI detector inspection and electrical test g* Y0 L: ?" R8 \ & VB. Double sided mounting: A-side solder paste printing machine → SMT machine (manual mounting and machine automatic mounting) → reflow soldering → B-side pre coated solder paste printing machine → SMT machine (manual mounting and machine automatic mounting) → reflow soldering → AOI detector inspection and electrical test.
/ V) ^;?) i- a6 w+ _1 Y* [( |$ Y) p0 W8 z6 {.
MWave soldering process: insert the component into the corresponding component hole → precoat flux → pre dry → wave soldering → remove the redundant plug-in pin → check.
& W $O7 V (Q    v9 [& u0 K7 i" |    P4 S$ ?! c5 Y4 b1 L; ]+ r& D      Reflow soldering chip components are relatively small pin mounted components on the circuit board.
wave soldering are relatively large plug-in components with pins, The plug-in components are inserted on the circuit board and occupy relatively large space.
if the wave soldering process is used first,
then the reflow soldering process of the chip components can be completed.
according to the assembly sequence of the circuit board components.
reflow soldering first and then wave soldering. C) R8 _# k* |3 b2 |$ z' Q. l9 t8 s: R1 P/ c5 w* F- {2 H.
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