Introduction of preheating zone of reflow soldering furnace
Author:Liang Shurong Time:2021-06-07 10:13 Browse(221)
Introduction of welding preheating zone of reflow oven, touch screen and OLED Forum
8 m. `' l) D6 l. K. T) e* O- o" Q6 L6 n0 p! E2 ?       Reflow soldering is the most commonly used method of surface adhesion technology (SMT) for bonding electronic components to printed circuit boards, The other way is to connect the electronic components through the through-hole plug-in (THT).

Introduction of preheating zone of reflow soldering furnace

the through-hole plug-in is to fill the existing holes in the circuit board with solder paste.
insert the pins into the solder paste and insert the electronic components into the board for soldering.
because wave soldering is cheaper and simpler.
so the reflow soldering will not be used in the circuit board with through-hole plug-in.
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j# |2 @9 Y* k1 R- f5 j        The purpose of reflow soldering is to gradually melt the solder and slowly heat the interface, so as to avoid the damage of electronic components caused by rapid heating.
in the traditional reflow soldering process, it is usually divided into four stages, and each zone has its own temperature curve: "preheating", "soaking", "reflow" and "cooling" preheating are the first stage of reflow soldering, The temperature of the whole component assembly plate to the target soaking temperature.
it is mainly to make the component assembly plate reach the soaking working temperature (pre reflow temperature) safely and gradually.
it can also vaporize and volatilize the volatile solvent in the solder paste.
the temperature of the whole component assembly plate to the target soaking temperature& |" B8 n2 ^9 d6 C0 H9 H) L$ Q; R9 |2 h1 a      The heating of the circuit board must be stable and linear.
an important indicator is to observe the rate of temperature rise, or the slope of temperature rise to time, in centigrade per second.
the heating of the circuit board must be stable and linearMany variables will affect the slope.
including the set heating time, the volatility of solder paste and the consideration of high temperature tolerance of electronic components.
all conditions are quite important.
but generally speaking, the consideration of high temperature tolerance of electronic components is often the most important.
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