How to analyze the cause of poor marking after the finished product is pasted with the cover plate
Author:Liao Wenhua Time:2021-06-11 11:19 Browse(454)
How can we analyze the cause of poor marking in the finished product test after G + F and TP laminating the cover plate,&V6 F7 h. E0 E1 p'z! E ﹣ note: we have a test on the semi-finished products after pressing, and then do the secondary finished product test marking after defoaming the patch, but the secondary finished product test marking is not good. Analyze the reasons for the poor function, mainly because: when the finished product test is finished, it basically indicates that the semi-finished product test on the pressing side is OK, except for the false test, there is only dispensing between that test and the secondary test, In principle, there should be no defects in the processes of defoaming and mounting. If there is a bad marking, I don't know how to analyze it. The main consideration is that the mounting is bad, and the measurement is not good. It's difficult to check under the second dimension because there is OCA glue in the middle, and it's not easy to separate the cover sensor. Even if it's barely separated, it also changes the original state, Can not accurately analyze the bad, can think of the main process is the chip may be made of poor folding, the rest do not know how to analyze, ask God to point out!!!!! 1 L- M: S8 I. P% B9 q。
I learned.. Thank you for sharing..... Can you leave your contact information? Under the communication, I also encounter such problems. My qq183732463...
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